EPOXY RESIN MODIFIED WITH EPOXY GROUP-CONTAINING SILSESQUIOXANE, CURABLE RESIN COMPOSITION, CURED MATERIAL AND COATING AGENT

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin modified with an epoxy group-containing silsesquioxane, capable of forming a cured material having excellent heat-resistance and adhesiveness to inorganic materials and keeping adhesiveness to inorganic materials even under high temperature and humidity conditions.;SOLUTION: There is provided an epoxy resin (1) modified with an epoxy group-containing silsesquioxane, produced by dealcoholization condensation reaction of a hydroxyl-containing epoxy resin (A) with a silsesquioxane compound (B) having epoxy group and alkoxy group, having an alkoxy group equivalent of 150-3,000 g/eq, an epoxy equivalent of 150-500 g/eq, a molar ratio [molar number of epoxy group derived from component (A)]/[molar number of epoxy group derived from component (B)] of ≥0.1 and ≤3, and a weight ratio of (A) and (B) [component (B)/component (A)] of 0.2-8.;COPYRIGHT: (C)2013,JPO&INPIT