SPHERICAL COPPER FINE POWDER AND PROCESS FOR PRODUCTION OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a copper fine powder suitable for a conductive filler, and a process for production of the same.;SOLUTION: The spherical copper fine powder is characterized by having an average particle size of 0.05 to 0.25 μm and a specific surface area (BET) of 2.5 m²/g to 15.0 m²/g. The process for the production of spherical copper fine powder through disproportionation is characterized by adding copper suboxide to an aqueous medium containing an additive consisting of a natural resin, a polysaccharide, or a derivative thereof to prepare a slurry, adding a 5 to 50% aqueous solution of an acid to the slurry at once within 15 minutes, and then subjecting the resulting slurry to disproportionation.;COPYRIGHT: (C)2013,JPO&INPIT