Insulating resin composition, plated product, build-up layer forming material and wiring board forming material

摘要

PPROBLEM TO BE SOLVED: To provide an insulating resin composition capable of forming an insulating layer excellent in adhesion to a plating layer, a plated matter having the insulating layer formed from the insulating resin composition, a material for forming a build-up layer containing the insulating resin composition, and a material for forming a wiring substrate containing the insulating resin composition. PSOLUTION: The insulating resin composition includes a bisphenol A epoxy resin having a butadiene skeleton on its side chain and has its surface coated with a plating layer formed from a conductive material. Here, the bisphenol A epoxy resin having a butadiene skeleton on its side chain is preferably represented by formula (1) (wherein l, m and n each represent a given positive number). PCOPYRIGHT: (C)2010,JPO&INPIT