首页> 外国专利> Optical test of chiplet of the display device CROSS-REFERENCE TO RELATED APPLICATIONS DustinL. U.S. Patent Application No. 12 / 191,478 entitled No. is assigned to the assignee of the present invention is filed August 14, 2008 by Winters and other 'OLEDDeviceWithEmbeddedChipDriving' is referred to. The disclosure of this U.S. patent application is incorporated herein by reference.

Optical test of chiplet of the display device CROSS-REFERENCE TO RELATED APPLICATIONS DustinL. U.S. Patent Application No. 12 / 191,478 entitled No. is assigned to the assignee of the present invention is filed August 14, 2008 by Winters and other 'OLEDDeviceWithEmbeddedChipDriving' is referred to. The disclosure of this U.S. patent application is incorporated herein by reference.

机译:显示设备小芯片的光学测试[相关申请的交叉引用] DustinL。温特斯于2008年8月14日向本发明的受让人转让了标题为No.的美国专利申请No.12 / 191,478,并提及了其他“ OLEDDeviceWithEmbeddedChipDriving”。该美国专利申请的公开内容通过引用并入本文。

摘要

The method comprising placing the method comprising providing a display substrate having a plurality of control electrodes in the display area, the tiplet multiple in response to the controller, providing the control electrode current, each chip cmdlet, a separate substrate Testing multiple light emitters are formed on the chiplet in one or emits light in response to a current having a pixel connecting one pad is electrically connected to the control electrode, at least, it is provided to the control electrode and it, and that through the current, and controls the chiplet so as to emit light in one or more of the test light emitter formed on the chiplet in A by detecting light test light emitter is emitted , and to identify the chiplet or interconnect tiplet defective, the method comprising replacing or repairing a tiplet or interconnect tiplet defective, the organic light emitting substrate of the display area that is connected to the control electrode Method of manufacturing a display comprising and forming a diode.
机译:该方法包括放置该方法,该方法包括:在显示区域中提供具有多个控制电极的显示基板,响应于控制器,多个小尖端;提供控制电极电流;每个芯片cmdlet;单独的基板。测试多个发光器。在小芯片上的一个中或响应于电流而发光,具有连接一个焊盘的像素电连接到控制电极,至少将其提供给控制电极和它,并通过该电流控制小芯片通过检测被测光发射器发出的光,从而在形成于A中的小芯片上的一个或多个测试发光器中发光,并识别出小芯片或互连芯片的缺陷,该方法包括更换或修复芯片或互连芯片的缺陷。有缺陷的显示区域的有机发光基板与控制电极连接y包括并形成二极管。

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