Contact site composition in the fragile inorganic layer of electronic devices

摘要

An electronic device (10, 20, 30, 40) is provided which comprises a substrate (16) supporting an inorganic layer (11) and a joint (13), mechanically coupling a contacting element (14) to the inorganic layer (11). At least a first load distributing layer (12a) is arranged in direct contact with the inorganic layer (11) at a position of the joint (13) for relieving stress caused by an elastic mismatch between the substrate (16) and the inorganic layer (11).