Production manner of the device, and the aforementioned coil enclosure powder compacting core which possess the coil enclosure powder compacting core and the aforementioned coil enclosure powder compacting core, and production manner of the aforementioned device

摘要

The present invention provides a coil enclosed dustcore which can increase the solderability compared with the prior art and a method for manufacturing the same. The coil enclosed dustcore is provided with a terminal unit, which enables the powder of Fe-based metal glass alloy to be cored to form the dustcore through a binding material and is use for connection of the coil covered by the dustcore and the external of the coil and wherein the Fe-based metal glass alloy is represented by the formula: Fe100-a-b-c-x-y-z-tNiaSnbCrcPxCyBzSit, 0at%=a=10at%, 0at%=b=3at%, 0at=c=6at%, 6.8at%=x=10.8at%, 2.2at%=y=9.8at%, 0at%=z=4.2at%, and 0at%=t=3.9at% and the terminal unit is prepared by Cu base material (15), a bottom layer (16) formed ON the surface of the Cu base material (15), and an electrode layer (17) formed ON the surface of the bottom layer, the bottom layer is formed of Ni and the surface electrode layer is formed of Ag or Ag-Pd.