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Systems and methods for the detection and quantification of the wafer edge (edge) features

机译:用于检测和量化晶圆边缘(边缘)特征的系统和方法

摘要

Method for improving the detection and quantification of the features in the edge of the wafer / wafer roll-off region is disclosed herein. Modifications and improvements make it possible to increase the range and improve the accuracy of feature detection is made to the conventional method.
机译:本文公开了用于改善对晶片/晶片滚落区域的边缘中的特征的检测和量化的方法。修改和改进使得可以增加范围并提高对传统方法进行的特征检测的准确性。

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