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For microwave cooking chips manufacturer with a food slicer and food slicer

机译:对于带有食物切片机和食物切片机的微波烹饪芯片制造商

摘要

An object of the present invention while applying the waveform shape to provide a food slicer for processing extremely thin ingredients. A food slicer 1, a main body 2 that first and second slide surfaces 21 and 23 are formed for sliding the food 4 is provided between the first and second slide surfaces 21 and 23 the blade It comprises a part 22, an opening 24 provided between the first sliding surface 21 and the blade section 22. The blade unit 22 has a waveform cross-section made up of a continuous wave. First and second slide surfaces 21 and 23, respectively, have substantially the same shape of cross section as the cross section of the blade portion 22. The first sliding surface 21, disposed at a position 0.1mm~3mm lower than the upper surface of the blade portion 22 in a state where the cross-section of the first sliding surface 21 is moved in parallel vertically downward relative to the cross-section of the blade section 22 differentially. The second sliding surface 23, the cross section of the second running surface 23 is located on the blade portion 22 of the same height to match the cross section of the blade portion 22, wherein the wave height of the wave is 2mm or more. .BACKGROUND 4
机译:本发明的目的是在施加波形形状的同时提供一种用于处理极薄成分的食物切片机。在切片机的第一滑动面21和第二滑动面23之间,设置有食物切片机1,主体2,主体2形成有用于使食物4滑动的第一滑动面21和第二滑动面23。主体2包括部分22,设置在其间的开口24。第一滑动表面21和叶片部22。叶片单元22具有由连续波构成的波形截面。第一滑动表面21和第二滑动表面23分别具有与叶片部分22的横截面基本相同的横截面形状。第一滑动表面21设置在比叶片部分22的上表面低0.1mm〜3mm的位置。在第一滑动面21的截面相对于叶片部22的截面在上下方向上平行地向下方平行地移动的状态下,叶片部22相对于叶片部22的截面不同。第二滑动表面23,第二运行表面23的横截面位于相同高度的叶片部分22上,以匹配叶片部分22的横截面,其中波浪的波浪高度为2mm或更大。 。背景4

著录项

  • 公开/公告号JP3183827U

    专利类型

  • 公开/公告日2013-05-30

    原文格式PDF

  • 申请/专利权人 株式会社曙産業;

    申请/专利号JP20130001565U

  • 发明设计人 大山 剛;

    申请日2013-03-21

  • 分类号A47J43/20;A47J43/25;

  • 国家 JP

  • 入库时间 2022-08-21 16:55:39

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