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摘要

PROBLEM TO BE SOLVED: To provide a multi-piece wiring board which is divisible into individual-piece wiring boards so as to suppress the occurrence of scoops in a plating connecting conductor even when promoting the processing for making the mother board thin.;SOLUTION: The multi-piece wiring board has a mother board 11 which has a plurality of wiring board regions 12 arranged in longitudinal and lateral arrangements and has wiring conductors 13 on the surfaces of the wiring board regions 12, dividing grooves 15 formed on the principal surface of the mother board 11 and formed in the right and left boundary 17 of each wiring board region 12, and plating connecting conductors 14 each of which connects the wiring conductors 13 with each other across the boundary 17 of each wiring board region 12. Hereupon, the thickness of each plating connecting conductor 14 which is present in the right and left boundary 17 of each wiring board region 12 is smaller than the thickness of the conductor which is present in each wiring board region 12. The thickness of each plating connecting conductor 14 which is present in the portion broken together with the mother board 11 becomes relatively thin, so that a large stress applied to each plating connecting conductor 14 is suppressed when breaking the mother board 11, and the scoop of each plating connecting conductor 14 which is caused by this stress is suppressed.;COPYRIGHT: (C)2010,JPO&INPIT