Piling up the Itadori profitable device and

摘要

PROBLEM TO BE SOLVED: To provide a wafer pick-up device preventing double pick-up of wafers.;SOLUTION: The wafer pick-up device 100 includes a placement table 20 for stackingly placing a plurality of wafers 10, a suction pad 32 (holding mechanism 30) that holds the first wafer 11 among the plurality of wafers 10 stacked on the placement table 20, an air nozzle 52 for separation and an elevating mechanism 80 (separation mechanism 50) that separates the second and subsequent wafers from the first wafer after the holding mechanism 30 holds the first wafer 11, an air nozzle 42 for bending (bending mechanism 40) that bends the center of the first wafer 11 downward by blowing air to the surface of the first wafer 11 when the separation mechanism 50 separates the second and subsequent wafers from the first wafer 11.;COPYRIGHT: (C)2010,JPO&INPIT