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With the sticking means which stick

机译:用哪一种方法贴

摘要

PROBLEM TO BE SOLVED: To prevent an adherend such as a wafer from being taken up together with an adhesion sheet when the adhesion sheet is peeled.;SOLUTION: A sheet peeling device 10 includes a holding means 11 of holding a wafer W on which the adhesion sheet S is stuck, a sticking means 16 of sticking the peeling tape PT on the adhesion sheet S, and a peeling means 15 of peeling the adhesion sheet S from the wafer W through the peeling tape PT. The peeling means 15 has first and second rollers 31 and 32 capable of pinching the peeling tape PT and adhesion sheet S. The first roller 31 is made bendable to oppose the adhesion sheet S having been peeled and the adhesion sheet S which is not peeled to each other. The first roller 31 is displaced through a displacement means 30 to leave and approach the wafer W, and adjusts the peeling angle α between the peeling tape PT and adhesion sheet S, and the wafer W.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:为了防止在剥离粘合片时晶片等被粘物与粘合片一起被吸收;解决方案:片剥离装置10包括用于保持晶片W的保持装置11。粘附粘合片S,将剥离带PT粘附在粘附片S上的粘附装置16,以及通过剥离带PT从晶片W剥离粘附片S的剥离装置15。剥离装置15具有能够夹持剥离带PT和粘合片S的第一辊31和第二辊32。使第一辊31可弯曲以与已经剥离的粘合片S和未剥离的粘合片S相对。彼此。第一辊31通过移位装置30移位以离开并接近晶片W,并调节剥离角α。剥离带PT和粘合片S和晶片W之间的位置。;版权所有:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP5149122B2

    专利类型

  • 公开/公告日2013-02-20

    原文格式PDF

  • 申请/专利权人 リンテック株式会社;

    申请/专利号JP20080271792

  • 发明设计人 高野 健;吉岡 孝久;

    申请日2008-10-22

  • 分类号H01L21/683;H01L21/301;

  • 国家 JP

  • 入库时间 2022-08-21 16:54:39

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