PROBLEM TO BE SOLVED: To prevent an adherend such as a wafer from being taken up together with an adhesion sheet when the adhesion sheet is peeled.;SOLUTION: A sheet peeling device 10 includes a holding means 11 of holding a wafer W on which the adhesion sheet S is stuck, a sticking means 16 of sticking the peeling tape PT on the adhesion sheet S, and a peeling means 15 of peeling the adhesion sheet S from the wafer W through the peeling tape PT. The peeling means 15 has first and second rollers 31 and 32 capable of pinching the peeling tape PT and adhesion sheet S. The first roller 31 is made bendable to oppose the adhesion sheet S having been peeled and the adhesion sheet S which is not peeled to each other. The first roller 31 is displaced through a displacement means 30 to leave and approach the wafer W, and adjusts the peeling angle α between the peeling tape PT and adhesion sheet S, and the wafer W.;COPYRIGHT: (C)2010,JPO&INPIT
展开▼