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Laser processing apparatus and optical path adjusting method in laser processing apparatus

机译:激光加工装置及激光加工装置中的光路调整方法

摘要

PPROBLEM TO BE SOLVED: To provide a laser beam machining apparatus which facilitates adjustment of the irradiation direction of a laser beam to a slit even if the laser beam to be used for laser beam machining is invisible light, and also to provide an optical path adjusting method in the laser beam machining apparatus. PSOLUTION: The laser beam machining apparatus 1 is constituted so that laser beams having a plurality of wavelengths including those in invisible region are emitted from a laser oscillator 10 and, of the laser beams, these having a prescribed wavelength are filtered by any of wavelength filters 32a-32d, and the filtered laser beams are reflected by reflection angle adjusting mirrors 33a-33d and emitted to a target 42 arranged in an optical path, and the target 42 converts the laser beams to visible light and reflects them, thereby the position of irradiating the slit with the laser beams can be made visible. PCOPYRIGHT: (C)2010,JPO&INPIT
机译:

要解决的问题:提供一种即使在激光加工中使用的激光是不可见光的情况下,也能够容易地调整激光对狭缝的照射方向的激光加工装置,并且提供一种激光加工装置。激光加工装置中的光路调整方法。

解决方案:激光束加工设备1被构造成使得具有包括不可见区域中的那些波长在内的多个波长的激光束从激光振荡器10发射,并且在具有预定波长的激光束中,通过任何方式对它们进行滤波。波长滤光器32a-32d,并通过反射角调节镜33a-33d反射并发射到布置在光路中的目标42,目标42将激光束转换为可见光并将其反射,从而可以看到用激光束照射狭缝的位置。

版权:(C)2010,日本特许厅&INPIT

著录项

  • 公开/公告号JP5189472B2

    专利类型

  • 公开/公告日2013-04-24

    原文格式PDF

  • 申请/专利权人 株式会社ミツトヨ;

    申请/专利号JP20080308487

  • 发明设计人 田中 祥一;岡部 憲嗣;

    申请日2008-12-03

  • 分类号B23K26/04;B23K26/08;B23K26;B23K101/40;

  • 国家 JP

  • 入库时间 2022-08-21 16:54:35

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