Method for manufacturing wiring structure manufacturing method, device, device, droplet discharge head, of the droplet discharge head, and liquid droplet ejection apparatus

摘要

PROBLEM TO BE SOLVED: To provide a highly reliable wiring structure which can pass electricity while preventing disconnection between step differences, and also to provide a device, a manufacturing method for the device, a liquid droplet ejection head, a manufacturing method for the liquid droplet ejection head, and a liquid droplet ejector.;SOLUTION: The wiring structure 500 has an upper substrate 20 joined via an adhesive layer 3 onto a lower substrate 10, and is equipped with a wiring line 34 drawn from a top face side of the upper substrate 20 through a side face to a top face side of the lower substrate 10. A projecting part T which contacts the top face side of the lower substrate 10 is formed at an outer edge of a joining face side to the lower substrate 10 of the upper substrate 20. The wiring line 34 is drawn to the top face side of the lower substrate 10 passing a surface of the projecting part T, and electrically connects a first conductive part 90 formed at the top face side of the lower substrate 10 and a second conductive part 44 formed at the top face side of the upper substrate 20 with each other.;COPYRIGHT: (C)2008,JPO&INPIT