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Being harmful element management manner in the harmful element

机译:有害元素中的有害元素管理方式

摘要

PROBLEM TO BE SOLVED: To manage hazardous elements through the use of a measuring method having only few errors in a method for managing hazardous elements in semiconductor sealing resins by a fluorescent X-ray analysis apparatus.;SOLUTION: The method for managing hazardous elements in semiconductor sealing resins includes: the process of performing qualitatively the analysis by the fluorescent X-ray analysis apparatus to determine content; the sample preparation process of matching the upper and lower surfaces of samples and arranging the samples in overall X-ray irradiation surfaces; the process for performing quantitative analysis by measuring one surfaces of the samples and their opposite surfaces by the fluorescent X-ray analysis apparatus; and the process of performing determination based on threshold values through the use of determination results having fewer effects of coexistent elements among two items of data acquired in the quantitative analysis process. It is possible to accurately measure and manage hazardous elements in semiconductor sealing resins of semiconductor products by this method.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:通过使用荧光X射线分析仪管理半导体密封树脂中有害元素的方法中使用的误差很小的测量方法来管理有害元素;解决方案:半导体密封树脂包括:通过荧光X射线分析装置定性地进行分析以确定含量的步骤;以及使样品的上,下表面匹配并将样品布置在整个X射线照射表面中的样品制备过程;通过荧光X射线分析装置测量样品的一个表面和它们的相对表面进行定量分析的过程;通过使用在定量分析处理中获取的两项数据之间的共存元素的影响较小的确定结果,基于阈值进行确定的处理。通过这种方法可以准确地测量和管理半导体产品的半导体密封树脂中的有害元素。;版权所有:(C)2009,JPO&INPIT

著录项

  • 公开/公告号JP5134858B2

    专利类型

  • 公开/公告日2013-01-30

    原文格式PDF

  • 申请/专利权人 株式会社東芝;

    申请/专利号JP20070119575

  • 发明设计人 竹中 みゆき;沖 充浩;

    申请日2007-04-27

  • 分类号G01N23/223;

  • 国家 JP

  • 入库时间 2022-08-21 16:53:49

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