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The resin constituent for thermosetting metaplasia optical reflection, the substrate and its production manner, and optical semiconductor equipment null epoxy resin and the curing agent which

机译:用于热固性化生光反射的树脂成分,基板及其生产方法,以及光半导体设备用的环氧树脂和固化剂

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition, which can improve reliability such as reflow crack resistance, solder crack resistance, and heat resistance in production of an optical semiconductor device and has excellent optical characteristics after thermosetting, for light reflection and to provide an optical semiconductor mounting substrate using the thermosetting resin composition, a manufacturing method of the substrate, and the optical semiconductor device.;SOLUTION: The thermosetting resin composition for light reflection comprises (A) an epoxy resin, (B) a curing agent, (C) a curing catalyst, (D) an inorganic filler, (E) a white pigment, (F) a coupling agent, and (G) a modifier. For (G) the modifier, a compound having a structural unit shown by Formulas (I) and (II) is used.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供一种热固性树脂组合物,该组合物可以提高光学半导体装置的制造中的耐回流焊裂纹性,耐焊锡裂纹性和耐热性等可靠性,并且在热固性之后具有优异的光学特性,用于光反射并提供一种使用该热固性树脂组合物的光学半导体安装基板,该基板的制造方法以及该光学半导体装置。解决方案:用于光反射的热固性树脂组合物包含(A)环氧树脂,(B)固化剂,( C)固化催化剂,(D)无机填料,(E)白色颜料,(F)偶联剂,和(G)改性剂。对于(G)改性剂,使用具有式(I)和(II)所示的结构单元的化合物。版权所有:(C)2009,JPO&INPIT

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