The resin constituent for thermosetting metaplasia optical reflection, the substrate and its production manner, and optical semiconductor equipment null epoxy resin and the curing agent which

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition, which can improve reliability such as reflow crack resistance, solder crack resistance, and heat resistance in production of an optical semiconductor device and has excellent optical characteristics after thermosetting, for light reflection and to provide an optical semiconductor mounting substrate using the thermosetting resin composition, a manufacturing method of the substrate, and the optical semiconductor device.;SOLUTION: The thermosetting resin composition for light reflection comprises (A) an epoxy resin, (B) a curing agent, (C) a curing catalyst, (D) an inorganic filler, (E) a white pigment, (F) a coupling agent, and (G) a modifier. For (G) the modifier, a compound having a structural unit shown by Formulas (I) and (II) is used.;COPYRIGHT: (C)2009,JPO&INPIT