Casing for an electromagnetic beam emitting optoelectronic component and method for the manufacture of an electromagnetic beam emitting optoelectronic component and a casing for an electromagnetic beam emitting optoelectronic component or of an electromagnetic beam emitting component having such a casing

摘要

The housing (2) has a body (25) comprising a recess (50), in which a chip mounting surface is arranged, where the body is made from plastic or a ceramic material. An outer surface (24) of the body is arranged on a radiating side of the housing and provided with a shielding layer (3) that is provided for shielding an electromagnetic radiation, where the layer is made from plastic. The outer surface has an area running perpendicular to an optical axis of the housing and/or parallel to the chip mounting surface. An independent claim is also included for a method for manufacturing a housing for an optoelectronic component.