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The film thickness prediction method thickness prediction program, recording medium, and film thickness predicting apparatus
The film thickness prediction method thickness prediction program, recording medium, and film thickness predicting apparatus
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机译:膜厚预测方法厚度预测程序,记录介质和膜厚预测装置
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摘要
A film thickness predicting apparatus compares a measurement value of a copper plating formed on wiring grooves of various patterns measured using a TEG and a film thickness of the copper plating calculated based on a plating model and a condition file. The film thickness predicting apparatus then delivers optimal plating model from the comparison result and calculates the film thickness of the copper plating formed on a substrate surface to be designed using the optimal plating model. The film thickness predicting apparatus enables to conduct a highly accurate film thickness predicting simulation.
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