首页> 外国专利> Optical communication module and method for manufacturing the Peltier element thermoelectric conversion module, the Peltier element thermoelectric conversion module

Optical communication module and method for manufacturing the Peltier element thermoelectric conversion module, the Peltier element thermoelectric conversion module

机译:光通信模块和珀耳帖元件热电转换模块的制造方法,珀耳帖元件热电转换模块

摘要

PROBLEM TO BE SOLVED: To provide a gold-tin joint Peltier element thermoelectric conversion module useful for achieving a lead free module when viewing the whole optical communication module and prevention of optical axis deviation of a laser diode.;SOLUTION: A thermo-module 10 is constituted by joining a plurality of pairs of P type thermoelectric semiconductor elements 13a and N type thermoelectric semiconductor elements 13b between a ceramic substrate 11 on the heat dissipation side and a ceramic substrate 12 on the cooling side, and joining a lead wire 15 or a post 16 for power supply to a lead wire mounting land part 112a-1 of the ceramic substrate 11. The lead wire mounting land part 112a-1 of the ceramic substrate 11 and the lead wire 15 or the post 16 are joined with gold-tin layers. As the gold-tin layers 113, 123, gold-tin eutectic composition solder having a gold content of about 80% by weight is used.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供金-锡接合珀耳帖元件热电转换模块,该模块可用于在查看整个光通信模块时防止无铅模块,并防止激光二极管的光轴偏移。解决方案:热模块10通过在散热侧的陶瓷基板11和冷却侧的陶瓷基板12之间接合多对P型热电半导体元件13a和N型热电半导体元件13b,并接合引线15或引线A来构成P型热电半导体元件。用于向陶瓷基板11的引线安装焊盘部分112a-1供电的支柱16。陶瓷基板11的引线安装焊盘部分112a-1与引线15或支柱16通过金锡接合。层。作为金锡层113、123,使用金含量为约80重量%的金锡共晶组成的焊料。版权所有:(C)2009,日本特许厅&INPIT

著录项

  • 公开/公告号JP5092168B2

    专利类型

  • 公开/公告日2012-12-05

    原文格式PDF

  • 申请/专利权人 株式会社KELK;

    申请/专利号JP20090097029

  • 发明设计人 織田 稔;

    申请日2009-04-13

  • 分类号H01L35/10;H01L35/08;H01L35/34;H01S5/022;H01L23/38;

  • 国家 JP

  • 入库时间 2022-08-21 16:53:10

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