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Methods and Systems for On-Chip Osmotic Airflow Cooling

机译:片上渗透气流冷却的方法和系统

摘要

An apparatus for cooling a semiconductor element is provided. The apparatus can include an electron emitter configured to emit electrons such that at least some of the emitted electrons become attached to air particulates and an air accelerator configured to generate an electric field that accelerates the air particulates toward the air accelerator to create an air flow over at least a portion of the semiconductor element. The air flow carries heat away from the at least a portion of the semiconductor element.
机译:提供了一种用于冷却半导体元件的设备。该设备可以包括:电子发射器,其构造成发射电子,使得至少一些所发射的电子附着到空气微粒上;以及空气加速器,构造成产生电场,该电场使空气微粒朝着空气加速器加速,从而在上方产生气流。半导体元件的至少一部分。空气流将热量从半导体元件的至少一部分带走。

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