MOLDING DIE, MICROCHIP MANUFACTURED BY USING MOLDING DIE, AND MANUFACTURING APPARATUS FOR MANUFACTURING MICROCHIP

摘要

A molding die for molding a substrate to be included in a microchip includes a first die and a second die contactable with and separable from the first die. A molding space for molding the substrate and a gate for introducing resin into the molding space are formed between the first die and the second die. A molding surface of the first die includes a first-die substrate molding region which molds the one surface of the substrate, a gate-defining region which defines the gate, and a rising region which is located between the gate-defining region and the first-die substrate molding region and extends from an edge of the first-die substrate molding region toward the second die. The gate-defining region is closer to the second die than the first-die substrate molding region. A microchip and a manufacturing apparatus also are provided.