Disclosed is an analysis system and method for visualizing heat conduction of a solid state sample. The analysis system includes a sealed jig chamber, a jig, an air tempering unit, and a thermal image camera. The sealed jig chamber includes a chamber door for opening/closing the jig chamber. The jig is removeably mounted in the jig chamber and comprises a heat source in surface contact with a solid state sample to induce the heat conduction of the solid state sample. The air tempering unit supplies hot air into the jig and supplies cool air into the jig chamber. The thermal image camera photographs the heat conduction of the solid state sample to acquire a thermal image or video.
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