BLOCK COPOLYMER OF POLYMIDE AND POLYAMIC ACID, METHOD FOR PRODUCING THE BLOCK COPOLYMER, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE BLOCK COPOLYMER AND PROTECTIVE FILM FORMED USING THE BLOCK COPOLYMER

摘要

A block copolymer of a polyimide and a polyamic acid is disclosed. Further disclosed are a method for producing the block copolymer and a positive type photosensitive composition comprising the block copolymer. The solubility of the photosensitive composition in an alkaline aqueous solution is controlled to achieve high resolution of a pattern. Further disclosed are a protective film of a semiconductor device and an ITO insulating film of an organic light emitting diode (OLED), which are formed using the block copolymer. The protective film and the ITO insulating film are very stable over time.