首页> 外国专利> THERMOELECTRIC COOLING SYSTEM UTILIZING THE THOMSON EFFECT

THERMOELECTRIC COOLING SYSTEM UTILIZING THE THOMSON EFFECT

机译:利用汤姆逊效应的热电冷却系统

摘要

Thermoelectric cooling systems are disclosed that utilize the Thomson effect. The disclosed systems can be used, for example, in cryogenic applications. In one aspect, a system is provided for thermoelectric cooling. The system comprises a pair of semiconductor elements, a cold plate and a hot plate. The pair of semiconductor elements comprises a P-type semiconductor element having a first carrier concentration and an N-type semiconductor element having a second carrier concentration. The first carrier concentration is functionally graded over the P-type semiconductor element and the second carrier concentration is functionally graded over the N-type semiconductor element. Each semiconductor element has a cold end and a hot end. The cold plate is thermally coupled to the cold ends of the P-type semiconductor elements and the N-type semiconductor element. The hot plate is thermally coupled to the hot ends of the P-type semiconductor element and the N-type semiconductor element.
机译:公开了利用汤姆森效应的热电冷却系统。所公开的系统可以例如在低温应用中使用。在一个方面,提供了一种用于热电冷却的系统。该系统包括一对半导体元件,一个冷板和一个热板。一对半导体元件包括具有第一载流子浓度的P型半导体元件和具有第二载流子浓度的N型半导体元件。在P型半导体元件上,第一载流子浓度在功能上被分级,在N型半导体元件上,第二载流子浓度在功能上被分级。每个半导体元件具有冷端和热端。冷却板与P型半导体元件和N型半导体元件的冷端热耦合。热板与P型半导体元件和N型半导体元件的热端热耦合。

著录项

  • 公开/公告号US2013074898A1

    专利类型

  • 公开/公告日2013-03-28

    原文格式PDF

  • 申请/专利权人 G. JEFFREY SNYDER;

    申请/专利号US201213625664

  • 发明设计人 G. JEFFREY SNYDER;

    申请日2012-09-24

  • 分类号H01L35/32;

  • 国家 US

  • 入库时间 2022-08-21 16:49:47

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