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METHOD FOR PRODUCING A STRUCTURE COMPRISING AT LEAST ONE ACTIVE PART HAVING ZONES OF DIFFERENT THICKNESSES

机译:制作至少一个具有不同厚度区域的有效部位的结构的方法

摘要

Method for producing a structure comprising an active part comprising a first and a second suspended zone of different thicknesses from a first comprising substrate, said method comprising the following steps:a) machining the front face of the first substrate to define the lateral contours of at least one first suspended zone according to a first thickness less than that of the first substrate,b) forming a stop layer of etching of the first suspended zone under said suspended zone, to do this a prior step of removal of the semi-conductor material arranged under the first suspended zone takes place,c) forming on the front face of the first substrate a sacrificial layer,d) machining from the rear face of the first substrate up to releasing said sacrificial layer to form at least one second suspended zone to reach the stop layer of the first suspended zone,e) releasing the first and second suspended zones.
机译:用于生产包括有源部件的结构的方法,该有源部件包括与第一包含基板的厚度不同的第一和第二悬挂区,所述方法包括以下步骤: a)加工第一基板的正面,以根据小于第一基板厚度的第一厚度来定义至少一个第一悬吊区域的侧面轮廓, b)形成对所述悬浮区下方的第一悬浮区进行蚀刻的停止层,为此,进行去除布置在第一悬浮区下方的半导体材料的先前步骤。 , c)在第一基板的正面上形成牺牲层, d)从第一衬底的背面进行机械加工,直到释放所述牺牲层,以形成至少一个第二悬浮区,以到达第一悬浮区的停止层, e)释放第一个和第二个暂挂区域。

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