首页> 外国专利> Cylindrical Rotating Magnetron Sputtering Cathode Device and Method of Depositing Material Using Radio Frequency Emissions

Cylindrical Rotating Magnetron Sputtering Cathode Device and Method of Depositing Material Using Radio Frequency Emissions

机译:圆柱形旋转磁控溅射阴极装置及利用射频辐射沉积材料的方法

摘要

A rotating magnetron sputtering cathode apparatus comprising a radio frequency power supply, a power delivery assembly, a cylindrical rotating cathode, a shaft and a drive motor, wherein the power delivery assembly comprises a magnetic field source positioned within the cathode and an electrode extending within said cathode to transmit radio frequency energy to target material on the outer surface of the cathode. The electrode is electrically isolated from the shaft, and is formed from non-ferrous materials, and the shaft is mechanically connected to the cathode such that they remain electrically isolated while the cathode rotates about the magnetic field source and a portion of the electrode. The power supply is adapted to supply radio frequency energy at frequencies of 1 MHz or higher and is electrically connected to the electrode. A method of depositing material with a rotating cylindrical magnetron sputtering cathode apparatus comprising a radio frequency power supply and a cylindrical rotating cathode is also disclosed wherein the outer surface of the rotating cathode comprises a target material formed of an oxide. The method comprises the steps of causing the power supply to supply radio frequency energy at frequencies of 1 MHz or higher, causing the cathode to rotate, and positioning a substrate proximate to said outside surface of said cathode whereby the radio frequency energy causes the cathode to eject particles from the target material onto the substrate.
机译:旋转磁控溅射阴极设备,包括射频电源,功率传输组件,圆柱形旋转阴极,轴和驱动马达,其中,功率传输组件包括位于阴极内的磁场源和在所述阴极内延伸的电极阴极将射频能量传输到阴极外表面上的目标材料。电极与轴电绝缘,并由有色金属材料制成,轴与阴极机械连接,从而在阴极绕磁场源和电极的一部分旋转时,电极保持电绝缘。电源适于以1MHz或更高的频率提供射频能量,并且电连接到电极。还公开了一种利用包括射频电源和圆柱形旋转阴极的旋转圆柱形磁控溅射阴极设备沉积材料的方法,其中旋转阴极的外表面包括由氧化物形成的靶材。该方法包括以下步骤:使电源以1MHz或更高的频率提供射频能量;使阴极旋转;以及将基板放置在所述阴极的所述外表面附近,从而使射频能量使阴极将粒子从目标材料喷射到基板上。

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