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Interdigitated microelectrode and a process for producing the interdigitated microelectrode

机译:叉指型微电极和制备叉指型微电极的方法

摘要

An interdigitated microelectrode (2) comprising a substrate (4), a first layer (6) of a first metal on the substrate (4), and a second layer (8) of a second metal on the substrate (4), the first layer (6) comprising a plurality of line microelectrodes (10) which are connected at a first end (12) and are not connected at a second end (14), the second layer (8) comprising a plurality of line microelectrodes (16) which are connected at a first end (18) and are not connected at a second end (20), the line microelectrodes (10) of the first layer (6) and the line microelectrodes (16) of the second layer (8) being such that they extend into each other but do not touch each other thereby to form an interdigititated microelectrode array (22), and the first metal being different from the second metal. A process for producing the interdigitated microelectrode (2) is also disclosed.
机译:指状微电极( 2 ),包括基板( 4 )和在基板上的第一金属的第一层( 6 )( 4 ),以及在基板( 4 )上第二金属的第二层( 8 ),第一层( 6 )包括多个线形微电极( 10 ),它们在第一端( 12 )连接,而在第二端( 14 < / B>),第二层( 8 )包括多个线形微电极( 16 ),它们在第一端( 18 )并没有连接到第二端( 20 ),第一层( 6 )的线微电极( 10 )和线第二层( 8 )的微电极( 16 )彼此延伸但彼此不接触,从而形成相互交叉的微电极阵列( 22 ),并且第一金属不同于第二金属。还公开了一种用于制造叉指状微电极( 2 )的方法。

著录项

  • 公开/公告号US8540858B2

    专利类型

  • 公开/公告日2013-09-24

    原文格式PDF

  • 申请/专利权人 DAVID ROBERT VINCENT;

    申请/专利号US20070087940

  • 发明设计人 DAVID ROBERT VINCENT;

    申请日2007-01-25

  • 分类号C25B11/02;C25B11/04;

  • 国家 US

  • 入库时间 2022-08-21 16:46:13

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