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Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method

机译:金属陶瓷基板或铜陶瓷基板的制造方法以及在该方法中使用的载体

摘要

A method is disclosed for producing metal-ceramic substrates that are metallized on both sides by using the direct bonding process. According to the method, at least one DCB stack made from first and a second metal layer and a ceramic layer located between said metal layers is formed on a separating layer of a support by heating to a direct bonding temperature. At least one of the metal layers rests against the separating layer during the bonding process, said separating layer being composed of a porous layer or coating made of a separating layer material from the group comprising mullite, Al2O3, TiO3, ZrO2, MgO, CaO CaCO2 or a mixture of at least two of said materials.
机译:公开了一种用于制造通过使用直接键合工艺在两侧都金属化的金属陶瓷基底的方法。根据该方法,通过加热至直接键合温度,在支撑体的隔离层上形成由第一金属层和第二金属层以及位于所述金属层之间的陶瓷层制成的至少一个DCB堆叠。在粘结过程中,金属层中的至少一层靠在隔离层上,所述隔离层由多孔层或涂层构成,该多孔层或涂层由莫来石Al 2 O中的一种构成 3 ,TiO 3 ,ZrO 2 ,MgO,CaO CaCO 2 或上述至少两种的混合物材料。

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