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Frontside-illuminated inverted quantum well infrared photodetector devices

机译:正面照明的倒置量子阱红外光电探测器设备

摘要

A method of fabricating a frontside-illuminated inverted quantum well infrared photodetector may include providing a quantum well wafer having a bulk substrate layer and a quantum material layer, wherein the quantum material layer includes a plurality of alternating quantum well layers and barrier layers epitaxially grown on the bulk substrate layer. The method further includes applying at least one frontside common electrical contact to a frontside of the quantum well wafer, bonding a transparent substrate to the frontside of the quantum well wafer, thinning the bulk substrate layer of the quantum well wafer, and etching the quantum material layer to form quantum well facets that define at least one pyramidal quantum well stack. A backside electrical contact may be applied to the pyramidal quantum well stack. In one embodiment, a plurality of quantum well stacks is bonded to a read-out integrated circuit of a focal plane array.
机译:一种制造正面照明的倒置量子阱红外光电探测器的方法可以包括提供具有体衬底层和量子材料层的量子阱晶片,其中量子材料层包括多个交替的量子阱层和在其上外延生长的势垒层。本体衬底层。该方法还包括:将至少一个正面公共电接触施加到量子阱晶片的正面;将透明衬底结合到量子阱晶片的正面;使量子阱晶片的体衬底层变薄;以及蚀刻量子材料。形成至少定义一个金字塔形量子阱叠层的量子阱刻面。背面电接触可以施加到金字塔形量子阱堆叠上。在一实施例中,多个量子阱堆叠键合至焦平面阵列的读出集成电路。

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