Advanced smart cards with integrated electronics in bottom layer and method of making such advanced smart cards

摘要

An advanced smart card with a top layer, a core layer of thermoset polymeric material, and a bottom layer comprising an integrated electronics assembly mounted on a substrate. The advanced smart card is formed by positioning a bottom layer in a bottom mold, placing a top layer in a top mold, closing the mold, injecting a thermosetting polymeric material to form a precursor advanced smart card, removing the precursor, and trimming the precursor to produce a finished smart card.