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METHODS AND APPARATUS FOR OPTIMIZATION OF INSPECTION SPEED BY GENERATION OF STAGE SPEED PROFILE AND SELECTION OF CARE AREAS FOR AUTOMATED WAFER INSPECTION
METHODS AND APPARATUS FOR OPTIMIZATION OF INSPECTION SPEED BY GENERATION OF STAGE SPEED PROFILE AND SELECTION OF CARE AREAS FOR AUTOMATED WAFER INSPECTION
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机译:通过生成阶段速度轮廓和自动晶圆检查的护理区域的选择来优化检查速度的方法和装置
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摘要
Disclosed are apparatus and methods for the generation of a stage speed profile and/or the selection of care areas for automated wafer inspection. The stage speed profile generated corresponds to a fastest speed the inspection machine is able to inspect provided a set of care areas. The set of care areas selected correspond to specific regions on the wafer which are to be imaged in detail by the inspection machine. The apparatus and methods herein may also calculate speed of inspection and coverage (and possibly other characteristics of the inspection) for a quantity of cases, and select the best trade-off of coverage versus inspection time using a cost function. Other aspects, features, and embodiments of the invention are also disclosed.
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