HOT-MELT ADHESIVE, CONTAINING POLY(METH)ACRYLATE THAT CAN BE RADIATION CROSS-LINKED AND OLIGO(METH)ACRYLATE THAT HAS NON-ACRYLIC C-C DOUBLE BONDS

摘要

The invention relates to a radiation cross-linkable hot-melt adhesive, containing at least one poly(meth)acrylate, which can be radiation cross-linked and which is formed from C1 to C10 alkyl(meth)acrylates to at least 60 wt%, and at least one oligo(meth)acrylate, which contains non-acrylic C-C double bonds and has a K value of less than or equal to 20. The hot-melt adhesive contains a photoinitiator, which can be present as an additive not bonded to the poly(meth)acrylate and/or not bonded to the oligo(meth)acrylate, can be polymerized into the poly(meth)acrylate, and/or can be bonded to the oligo(meth)acrylate. The hot-melt adhesive can be used to produce adhesive tapes.