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DEVICE AND METHOD FOR CUTTING OR SEPARATING SOLID MATERIALS BY MATERIAL REMOVAL BY MEANS OF ENERGETIC RADIATION
DEVICE AND METHOD FOR CUTTING OR SEPARATING SOLID MATERIALS BY MATERIAL REMOVAL BY MEANS OF ENERGETIC RADIATION
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机译:通过能量辐射手段去除材料来切割或分离固体材料的装置和方法
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摘要
The invention relates to a method and a device for cutting or separating solid materials by means of energetic radiation. In a hand-held machining head (19) a machining beam (13) is guided via a dynamic beam deflecting unit (10) through a beam outlet opening, by means of which the machining beam (13) can be directed to a machining location. During the machining, images of an area of the solid material (15) comprising the machining location (14) are continuously taken during the machining by means of an image recording unit (17). An image evaluation and control unit determines from the images a wrong movement when the machining head (19) is guided manually and actuates the dynamic beam deflecting unit for the purpose of a beam position correction. The beam outlet opening is formed on one end of a tube (19') above which a shaft (20) protrudes that can be introduced into the kerf (16) on the solid material (15) and thereby facilitates lateral guidance of the tube (19') during machining. Using the proposed device and the associated method, narrow kerf width having a high quality can be produced when performing hand-guided cutting and separation procedures in solid materials.
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