首页> 外国专利> SYSTEM MODULE FOR BUILDING ELECTRICAL INSTALLATION TECHNOLOGY AND DOOR COMMUNICATION TECHNOLOGY

SYSTEM MODULE FOR BUILDING ELECTRICAL INSTALLATION TECHNOLOGY AND DOOR COMMUNICATION TECHNOLOGY

机译:建筑电气安装技术和门通信技术的系统模块

摘要

The present invention relates to a system module for building electrical installation and door communication, consisting of a module lower part (2) and a functional upper part (3) detachably connected to said lower part. The module lower part (2) is used for mounting on a system support. The module lower part (2) has a cuboid-shaped base part (4), which holds a circuit carrier (6) with the electronic circuit thereof. The circuit carrier (6) has on one side two multiple contacts (7, 8) for connection of a bus line. The multiple contacts (7, 8) are electrically assigned such that they form both input pads and output pads for electrical signal processing and voltage supply. The multiple contacts (7, 8) can be accessed via openings (11) in the base part (4). The invention further relates to a system arrangement of a plurality of system modules according to the invention.
机译:用于建筑电气安装和门通信的系统模块技术领域本发明涉及一种用于建筑电气安装和门通信的系统模块,该系统模块包括模块下部(2)和可拆卸地连接至所述下部的功能上部(3)。模块下部(2)用于安装在系统支架上。模块下部(2)具有长方体形的基部(4),该基部固定带有电子电路的电路载体(6)。电路载体(6)在一侧具有两个用于连接总线的多个触点(7、8)。电气分配了多个触点(7、8),以便它们同时形成用于电信号处理和电压供应的输入焊盘和输出焊盘。可以通过底座部件(4)中的开口(11)进入多个触点(7、8)。本发明还涉及根据本发明的多个系统模块的系统布置。

著录项

  • 公开/公告号WO2013143930A1

    专利类型

  • 公开/公告日2013-10-03

    原文格式PDF

  • 申请/专利权人 GIRA GIERSIEPEN GMBH & CO. KG;

    申请/专利号WO2013EP55774

  • 发明设计人 SCHIEFFER KLAUS;

    申请日2013-03-20

  • 分类号H02G3/08;H02G3/14;

  • 国家 WO

  • 入库时间 2022-08-21 16:30:33

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