High-power electronics component and assembly comprising at least one such high-power electronics component

摘要

The power electronic component has heat sink as cooling structure (2), power semiconductor module (1) and circuit arrangement (3) for controlling power semiconductor module. The cooling structure comprises parallel channels for accommodating flowing coolant. Several adjacent channels form supply channels having end regions connected by connecting channels, and return channels having start regions connected by connecting channels, while start regions of return channels are connected with end regions of supply channels. An independent claim is included for electrical arrangement having power electronic component.