首页> 外国专利> SHAPING DIE, MICROCHIP MANUFACTURED USING DIE, AND MANUFACTURING APPARATUS FOR MANUFACTURING MICROCHIP

SHAPING DIE, MICROCHIP MANUFACTURED USING DIE, AND MANUFACTURING APPARATUS FOR MANUFACTURING MICROCHIP

机译:成型模具,使用模具制造的微型芯片以及制造微型芯片的制造装置

摘要

The present invention provides a manufacturing apparatus for manufacturing a microchip, with which a microchip (2) is formed by attaching a film (4) to an inner side surface (3A) of a substrate (3). A shaping die (6) for shaping the substrate (3) comprises a fixed die (60) and a movable die (61) . A shaping space (64) for shaping the substrate (3) and a gate (63) for supplying a resin to the shaping space (64) can be formed between the fixed die (60) and the movable die (61). A shaping surface of the fixed die (60) comprises: a fixed die-substrate shaping region (606) for shaping the inner side surface (3A) of the substrate (3); a gate-defining region (607) for defining the gate (63); and a rising region (608) which is located between the gate-defining region (607) and the fixed die-substrate shaping region (606) and is provided rising from the edge section of the fixed die-substrate shaping region (606) toward the movable die (61). The gate-defining region (607) is provided closer to the movable die (61) than the fixed die-substrate shaping region (606) is close to the movable die (61).
机译:本发明提供一种用于制造微芯片的制造设备,利用该设备通过将膜(4)附着到基板(3)的内侧表面(3A)上来形成微芯片(2)。用于使基板(3)成形的成形模具(6)包括固定模具(60)和可动模具(61)。可以在固定模具(60)和可动模具(61)之间形成用于使基板(3)成形的成形空间(64)和向成形空间(64)供给树脂的浇口(63)。固定模具(60)的成型表面包括:固定模具-基板成型区域(606),用于成型基板(3)的内侧表面(3A);以及固定模具-成型区域(606)。用于限定栅极(63)的栅极限定区(607);上升区域(608),其位于栅极限定区域(607)与固定芯片基板成形区域(606)之间,并且从固定芯片基板成形区域(606)的边缘部向着上升方向设置。可动模具(61)。栅极限定区域(607)设置成比固定模具基板成形区域(606)靠近可动模具(61)更靠近可动模具(61)。

著录项

  • 公开/公告号EP2633970A1

    专利类型

  • 公开/公告日2013-09-04

    原文格式PDF

  • 申请/专利权人 KONICA MINOLTA INC.;

    申请/专利号EP20110836235

  • 发明设计人 SEKIHARA KANJI;

    申请日2011-10-25

  • 分类号B29C45/27;B01J19/00;B29C45/37;B81B1/00;B81C99/00;G01N37/00;

  • 国家 EP

  • 入库时间 2022-08-21 16:29:01

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号