首页> 外国专利> LASER CUTTING DEVICE, CAPABLE OF RAPIDLY AND EVENLY CUTTING AN AREA WIDER THAN AN AREA WHERE LASER BEAMS ARE IRRADIATED

LASER CUTTING DEVICE, CAPABLE OF RAPIDLY AND EVENLY CUTTING AN AREA WIDER THAN AN AREA WHERE LASER BEAMS ARE IRRADIATED

机译:激光切割设备,能够快速,均匀地切割比照射激光束的区域更大的区域

摘要

PURPOSE: A laser cutting device is provided to cut an area wider than an area where laser beams are irradiated and to rapidly and evenly cut a workpiece.;CONSTITUTION: A laser cutting device comprises a transferring member and a laser scanner(10). The transferring member transfers a workpiece along a first trace. The laser scanner irradiates laser beams on the workpiece along a second trace which is different from the first trace. When the workpiece is transferred by the transferring member, the laser beams are irradiated to the workpiece along the second trace, the laser beams cut the workpiece along an expected cut line.;COPYRIGHT KIPO 2013
机译:目的:提供一种激光切割装置,以切割比照射激光束的区域更宽的区域,并快速,均匀地切割工件。;组成:一种激光切割装置,包括传输部件和激光扫描仪(10)。传送构件沿着第一迹线传送工件。激光扫描仪沿着与第一迹线不同的第二迹线在工件上照射激光束。当工件由传输部件传输时,激光束沿第二条轨迹照射到工件上,激光束沿预期的切割线切割工件。; COPYRIGHT KIPO 2013

著录项

  • 公开/公告号KR20130036586A

    专利类型

  • 公开/公告日2013-04-12

    原文格式PDF

  • 申请/专利权人 JCOBS CO. LTD.;

    申请/专利号KR20110100759

  • 发明设计人 KIM IL HWAN;

    申请日2011-10-04

  • 分类号B23K26/38;B23K26/08;

  • 国家 KR

  • 入库时间 2022-08-21 16:27:23

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