COMPLIANT MULTILAYERED THERMALLY-CONDUCTIVE INTERFACE ASSEMBLY AND A MEMORY MODULE INCLUDING THE SAME, CAPABLE OF INCREASING THE THERMAL CONDUCTIVITY OF A THERMALLY-CONDUCTIVE PATH

摘要

PURPOSE: A compliant multilayered thermally-conductive interface assembly and a memory module including the same are provided to improve thermal conductivity by reducing the thermal impedance of a thermally-conductive path.;CONSTITUTION: An elastic heat dispersing member includes a first side (112), a second side (114), and one or more holes. The holes pass through from the first side to the second side. The elastic heat dispersing member is interposed between a first layer (122) and a second layer (124) of a thermal interface member (104). The thermal interface member includes a non-flat surface, a curved surface, or an irregular surface. The heat interface member is matched with a combination surface and is in contact with the combination surface.;COPYRIGHT KIPO 2013