SEMICONDUCTOR PACKAGE SORTING APPARATUS WHICH IS FIXED TO A PLANE ARRANGEMENT STATE WHILE HAVING A DIRECTIONAL ANGLE IN WHICH X-AXIS DRIVING MOTOR MEETS AT RIGHT ANGLE TO A Y-AXIS DRIVING MOTOR AND A TEST HANDLER APPLYING THE SAME

摘要

PURPOSE: A semiconductor package sorting apparatus and a test handler applying the same are provided to improve the durability of a power cable or a signal cable and to maintain the reliability of equipment.;CONSTITUTION: A sorting apparatus receives a semiconductor package which is moved from shooters sorter (34,35) through sorter unit. The sorting apparatus discharges the corresponding semiconductor package by moving a lower end sensor of the sorter unit to one position among multiple classification holes which are formed on a classification board according to rating information by a test result delivered from a package test unit (30). A first supporter is fixed on one side of the classification board. The first supporter is bent on the center and positions the top to the classification board side and fixes a first driving motor which generates Y-axis rotation power to outside. A second supporter is combined and fixed to a coupling side formed on the top of the first supporter. The second supporter has an arm which is vertically bent to both sides with a coupling side of center as the center and fixes a second driving motor which generates X-axis rotation power to outside.;COPYRIGHT KIPO 2013