THERMAL ANALYSIS METHOD OF HIGH POWER RF POWER AMPLIFIER COMPONENT

摘要

PURPOSE: the high-power RF power amplifier components (RF) of heat analysis method are provided to analysis and simplify channel temperature high energy dissipation RF devices. ;CONSTITUTION: thermal resistance modeled shape constitutes a radio-frequency power amplifier element about each stack material and is formed. It is fixed about thermal resistance modeled shape. The ready formula is that transformation passes through Kirchhoff transformation. The formula of transformation is simplified. The simplified formula is by thermal resistance representation method. ;The 2013 of copyright KIPO submissions