首页> 外国专利> ZR ALLOY PLATING OR TI ALLOY PLATING METHOD AND A PLATING SOLUTION FOR THE SAME TO SECURE HIGH COATING POWER

ZR ALLOY PLATING OR TI ALLOY PLATING METHOD AND A PLATING SOLUTION FOR THE SAME TO SECURE HIGH COATING POWER

机译:ZR合金镀层或TI合金镀层方法以及用于确保高镀层功率的镀层解决方案

摘要

PURPOSE: A Zr alloy plating or Ti alloy plating method and a plating solution for the same are provided to uniformly coat fine parts of a product with minute electric current at 0.5A/dm^2 by using a link complexing agent as well as a reducing agent.;CONSTITUTION: A method for preparing an electroplating solution for Ti alloy plating comprises the steps of: preparing a Ti compound, dissolving the Ti compound in water to liquefy, putting a citric acid compound as a complexing agent into the liquid, dissolving at least one of Ni to be alloyed with Ti, Co, Au, Pt, Cu, Pd, Pb, Ag, Zr, and metal compounds thereof in the liquefied solution, and regulating the pH of the solution to 1.0-12.0.;COPYRIGHT KIPO 2013;[Reference numerals] (AA) Link complexing agent; (BB) Other metal ion susceptible to eutectoid
机译:用途:提供一种Zr合金镀层或Ti合金镀层方法及其镀液,以通过使用一种连接络合剂以及一种还原剂,以0.5A / dm ^ 2的微小电流均匀地涂覆产品的细小部分。组成:一种制备用于钛合金电镀的电镀液的方法,包括以下步骤:制备钛化合物,将钛化合物溶解在水中液化,将柠檬酸化合物作为络合剂放入液体中,在室温下溶解。在液化溶液中与Ti,Co,Au,Pt,Cu,Pd,Pb,Ag,Zr及其金属化合物形成合金的Ni中的至少一种,并将溶液的pH值调节至1.0-12.0。 2013; [参考数字](AA)链接络合剂; (BB)易共析的其他金属离子

著录项

  • 公开/公告号KR101227059B1

    专利类型

  • 公开/公告日2013-01-28

    原文格式PDF

  • 申请/专利权人 YOON JONG O;

    申请/专利号KR20120088709

  • 发明设计人 YOON JONG O;

    申请日2012-08-14

  • 分类号C25D3/56;C25D21/12;

  • 国家 KR

  • 入库时间 2022-08-21 16:25:50

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