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LASER MACHINING APPARATUS, LASER MACHINING METHOD, MACHINING CONTROL APPARATUS AND MACHINING CONTROL METHOD

机译:激光加工设备,激光加工方法,加工控制设备和加工控制方法

摘要

A machining control apparatus (103) controls a machining table, which fixes the bottom surface of a work by suction by means of a suction hole, and a laser machining mechanism (101A) for making a hole on the work by irradiating the work with a laser beam. The machining control apparatus is provided with an extracting section (16) which extracts a machining hole which is to be positioned on an upper side of a suction area of the machining table; and a first time machining hole setting section (14), which sets, as holes to be machined for a first time, the machining holes other than the machining hole extracted by the extracting section (16) from among the machining holes to be machined. The machining controls apparatus controls the laser machining mechanism (101A) to perform the first time hole making machining.
机译:加工控制装置(103)控制加工台,该加工台通过利用吸引孔的吸附来固定工件的底面,并且控制激光加工机构(101A),该激光加工机构通过在工件上照射孔来对工件进行打孔。激光束。加工控制装置具备:抽出部(16),该抽出部(16)抽出位于加工台的吸引区域的上侧的加工孔。初次加工孔设定部(14)将从被加工部中提取出的由提取部(16)所提取的加工孔以外的加工孔设定为初次加工孔。加工控制装置控制激光加工机构(101A)进行第一时间孔加工。

著录项

  • 公开/公告号KR101251084B1

    专利类型

  • 公开/公告日2013-04-05

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20117007145

  • 发明设计人 모리 도시히로;

    申请日2009-03-04

  • 分类号B23K26/10;B23K26/38;

  • 国家 KR

  • 入库时间 2022-08-21 16:25:22

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