METHOD TO BUILD A WIREBOND PROBE CARD IN A MANY AT A TIME FASHION

摘要

can be produced by a very fine pitch to be very precisely positioned on the support substrate can, resilient contact structures are provided for use in a wafer test probe. Resilient contact structures are adapted for wire bonding to the electrical circuit on the space transformer substrate. Are attached to the support substrate resilient contact structures are produced in large quantities, as it can be tested prior to dicing can be attached to the space transformer substrate, thereby improving the yield. Resilient contact structures, resilient contact structures prior to bonding to the support substrate and the release layer is removed, the release layer to form a contact portion, is produced by using the photolithography technique. The support substrate may be transparent to allow the testing of the alignment of the optical component and the lower contact portion. A support substrate may comprise a ground plane is provided under the resilient contact structure for improved impedance matching. ;