RESIN COMPOSITION WHICH HAS PHOTOCURABLE AND THERMOSETTING PROPERTY AND DRY FILM SOLDER RESIST (DFSR) CAPABLE OF SECURING HIGH GLASS TRANSITION TEMPERATURE OF DFSR, IMPROVED HEAT RESISTING RELIABILITY AND LOW THERMAL EXPANSION COEFFICIENT

摘要

PURPOSE: A resin composition which has photocurable and thermosetting property is provided to form a predetermined triazine bridge structure inside the cured product of the resin composition which comprises a DFSR by having the specific acid-modified oligomer.;CONSTITUTION: A resin composition which has photocurable and thermosetting property comprises: an acid denaturation oligomer, a photopolymerizable monomer, a thermosetting binder, and a photoinitiator. The acid denaturation oligomer comprises an aminocarbonate-based compound. The aminocarbonate-based compound has aliphatic or alicyclic, carboxyl radical (-COOH), photocurable unsaturated functional group. The photopolymerizable monomer has more than 2 photocurable unsaturated functional groups. The thermosetting binder has the functional group in which heat curing is possible. 15-75 weight% of the acid denaturation oligomer is included based on the total weight of the resin composition. 5-30 weight% of the photopolymerizable monomer is included based on the total weight of the resin composition. 0.5-20 weight% of the photoinitiator is included based on the total weight of the resin composition. 0.8-2.0 equivalent of the thermosetting binder is included base on the 1 equivalent of the carboxyl radical of the acid denaturation oligomer.;COPYRIGHT KIPO 2013