MICROSTRIP TRANSMISSION LINE HAVING COMMON DEFECTED GROUND STRUCTURE

摘要

the subject innovation relates to a microstrip transmission line, particularly a common ground plane is etched in the dielectric a defect ground structure (Defected Ground Structure, DGS) a microstrip transmission line is configured with a symmetrical, and more particularly the etching of the slot structure and the insertion loss and the structure of the strip line resonators via the stub having a ground fault on the common symmetric structure relates to a microstrip transmission line which can simply adjust the resonance frequency. To this end, the present invention is to the first dielectric layer, is formed on the first dielectric layer, with a first stub on the end of the round or oval and the first strip line, the first to cover the first strip line and a second dielectric layer deposited on the dielectric layer, and at least a portion of the first strip line on the second dielectric layer to be formed so as to overlap in a vertical direction perpendicular to the two sides a circular portion or the first and second defect region having an elliptical structure and the first and second defect interconnect and a common ground conductive layer including a slot line a region, and a third dielectric layer stacked on the second dielectric layer to cover the common ground conductive layer, the first stripline and at least some overlap in the vertical direction, and said common ground conductive layer and at least a portion that is orthogonal to overlap in the vertical direction is formed on the third dielectric layer, and a second stub on the end of the second round or oval in that it comprises a strip line provides a microstrip transmission line according to claim. Thus, in accordance with the subject innovation, round or using a resonance frequency of the micro-strip line with a stub for connecting the signal lines having different elliptical layer of the multi-layer substrate, having different layer in a multilayer microwave board through which the millimeter-wave band module without requiring expensive equipment, the process by the simple configuration of circuit density and is easy to apply and effective in connection with the band pass filter of the microwave and millimeter wave signal between the layer between the multi-layer substrate for connection over several tens of GHz there. ;