首页> 外国专利> METHOD FOR PRODUCING PLATES OR HIGH RESISTANCE TILES FOR COVERING FLOORS OR WALLS IN ROOMS OR OUTDOORS AND PLATE OR HIGH RESISTANCE TILES

METHOD FOR PRODUCING PLATES OR HIGH RESISTANCE TILES FOR COVERING FLOORS OR WALLS IN ROOMS OR OUTDOORS AND PLATE OR HIGH RESISTANCE TILES

机译:生产用于覆盖房间或室外以及板或高电阻砖中的地板或墙壁的板或高电阻砖的方法

摘要

1. A method of producing plates or tiles of high resistance intended for coating floors or walls indoors or outdoors, comprising the following steps: - place a ceramic plate (1) or a tile having a visible surface; - place at least a sheet (2) made of metal or a metal alloy, having a coefficient of thermal expansion higher than the coefficient of thermal expansion of the first plate or tile, and the sheet (2) has the properties of viscosity and resistance to its easy destruction; - bring the plate or tile and fox (2) to a temperature which is at least 40 ° C greater than the operating temperature and the temperature of operation; and - glue the first plate or tile (1) to a thin base plate or base sheet (2) or vice versa, and this step includes the distribution of the adhesive layer on at least one of the two surfaces to be glued, followed by the pressing step, during which the first plate or tile (1) is pressed with a predetermined pressure on a thin base plate or base sheet (2); - leave the assembly thus obtained for cooling to ambient temperature due to the excellent coefficient of thermal expansion (shortening) ) a thin base plate or base plate (2) excites in the plate or tile (1) to which it is tightly adhered, a compression state starting from the bottom surface of the plate or tile (1), which is opposite to the visible surface. 2. The method according to claim 1, wherein the plate or tile is made of ceramic material or a similar material. The method according to claim 1, in which the sheet (2) is made of metal or a metal alloy and has a thickness m
机译:1.一种生产用于在室内或室外涂覆地板或墙壁的高电阻板或砖的方法,包括以下步骤:-放置具有可见表面的陶瓷板(1)或砖; -放置至少一块由金属或金属合金制成的,具有比第一板或瓷砖的热膨胀系数高的热膨胀系数的板(2),并且该板(2)具有粘性和耐性容易破坏; -使板或瓷砖和狐狸(2)的温度至少比工作温度和工作温度高40°C; -将第一板或瓦(1)粘合到薄的基板或基片(2)上,反之亦然,并且该步骤包括将粘合剂层分布在要粘合的两个表面中的至少一个上,然后压制步骤,在该步骤中,以预定的压力将第一板或砖(1)压在薄的基板或基片(2)上; -由于极好的热膨胀系数(缩短)而使由此获得的组件冷却至环境温度。)薄的基板或基板(2)在紧密粘附的板或瓷砖(1)中激发,从板或砖(1)的与可见表面相反的底表面开始压缩状态。 2.根据权利要求1所述的方法,其中,所述板或砖由陶瓷材料或类似材料制成。 2.根据权利要求1所述的方法,其中,所述片材(2)由金属或金属合金制成,并且厚度为m。

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