Power semiconductor component module for fastening at cooling body, has contact units for electrically contacting power semiconductor component, and plate with aperture partly arranged with heat conducting body

摘要

The module (1) has contact units (5a, 5b) for electrically contacting a power semiconductor component (6). A plunger (9), a counter bearing plate (10), a cup spring (11), a pan head screw (12) and a bolt (17) bias the contact units against the power semiconductor component for electrical contact and to bias the power semiconductor component against a cooling body for thermal contact through a heat conducting body (3) made of copper. A plate (2) with an aperture (13) is partly arranged with the heat conducting body. The power semiconductor component is selected from one of a silicon-steered rectifier (SCR), output regulator, power transistor, insulating gate bipolar transistor, MOSFET, power rectifier, a diode such as Schottky diode, junction-FET, and thyristor such as gate turn off thyristor, a gate communicated thyristor, a TRIAC, a DIAC and photo thyristor. An independent claim is also included for a method for assembling a power semiconductor module for fastening at a cooling body.