Illuminating device for e.g. video projector, has bonding wires which are provided between contact surface of n-polarized semiconductor light-emitting chip and front-side surface of metallization region

摘要

The illuminating device (L1) has an electrically insulating substrate (1) having metallization portion which is provided with p-polarized semiconductor light-emitting chip and n-polarized semiconductor light-emitting chip (4). The bonding wires (6) are provided between contact surface (5) of n-polarized semiconductor light-emitting chip and front-side surface of metallization region (3). The semiconductor light-emitting chips are formed of indium-gallium-nitride or aluminum-gallium-indium-phosphorous. The ceramic phosphor plates are formed in light-emitting chips.