Conditioning polyamide molded parts, comprises fluidically contacting molded parts with water molecules that are desorbed by a sorption agent arranged near the molded parts, and tempering a cavity of the molded parts or a housing

摘要

The method comprises fluidically contacting polyamide molded parts with water molecules that are desorbed by a sorption agent arranged near the polyamide molded parts, tempering a cavity of the molded parts or a housing to a temperature of 22-30[deg] C, performing sonication of the cavity in which the water sorption agent is arranged and/or sonication of the housing in which the molded parts and the water sorption agent are disposed using a woofer or a mechanically actuated diaphragm, and placing the sorption agent in fluid contact with a water reservoir. The method comprises fluidically contacting polyamide molded parts with water molecules that are desorbed by a sorption agent arranged near the polyamide molded parts, tempering a cavity of the molded parts or a housing to a temperature of 22-30[deg] C, performing sonication of the cavity in which the water sorption agent is arranged and/or sonication of the housing in which the molded parts and the water sorption agent are disposed using a woofer or a mechanically actuated diaphragm, and placing the sorption agent in fluid contact with a water reservoir. The sorption agent is a substance, which absorbs water of thirty to sixty times of its own weight. The sorption agent comprises an adsorbent such as silica gel, clay, activated charcoal, porous rock such as sandstone, sponge material, wick, cotton, blotting paper or a superabsorber. The step of contacting polyamide molded parts with water molecules comprises disposing the sorption agent in the cavity of the molded parts and/or arranging and positioning the sorption agent in the housing. Independent claims are included for: (1) a device for conditioning polyamide mold parts; and (2) a plant for conditioning polyamide mold parts.