Flashover-resistant arrangement for semiconductor component for electromotor of circulating pump, has contact surfaces formed at housing, where electrically non-conductive adhesive is applied between contact surfaces to prevent flashover

摘要

The arrangement has electrical contact surfaces (4) formed at a bottom side of a no-lead housing (2) of a semiconductor component (1) facing a substrate, where high voltage (9) exists between the contact surfaces during the operation of the semiconductor component. The contact surfaces of the housing are electrically connected with corresponding contact surfaces of the substrate. An electrically non-conductive adhesive (5) is applied in a region between the contact surfaces of the housing for preventing a voltage flashover between the semiconductor component and the substrate. The housing is a quad flat no-leads (QFN) housing or a land grid array housing. The substrate is a halogen-free printed circuit board.