Wire eroding processing apparatus, wire EDM processing method. Thin plate manufacturing process and semiconductor wafer manufacturing process

摘要

A wire electric discharge machining apparatus comprises a wire electrode, a guide roller which arranges wire electrodes in parallel by winding the wire electrode therethrough, a plurality of slidable contact conductors 62 slidably in sliding contact with the parallel wire electrodes, and a power feeding device which holds the slidable contact conductors 62 one by one via the slidable contact conductors 62 individually feeds energy into the parallel wire electrodes, wherein the power supply device comprises a plurality of reference surfaces, which determine a fixing space between the slidable contact conductors 62.